Electrical Industry Scholarship Program (EISP) Winners
The following individuals were chosen as the EISP scholarship recipients for 2008. The college information listed is taken from the recipient's original application and will be verified upon receipt of their acceptance verification.
Winner #1
William Thomas Hinderman
Orland Park, IL
HS GPA: 4.765/4.0
College Major: Computer Science/ Engineering
College to Attend: University of Illinois at Urbana-Champaign
Alternate #1
Maxwell E. Martin
Schaumburg, IL
HS GPA: 4.268/4.0
College Major: Electrical Engineering
College to Attend: Milwaukee School of Engineering
Winner #2
Brian Connaghan
Oak Lawn, IL
HS GPA: 4.075/4.0; College GPA: 3.37/4.0
College Major: Electrical Engineering
College Attending: University of Illinois at Urbana-Champaign
Alternate #2
Phillip Prince
New Lenox, IL
HS GPA: 4.238/4,0
College Major: Civil Engineering
College to Attend: University of Illinois at Urbana-Champaign
